Electronic component and method for manufacturing electronic component

ABSTRACT

An electronic component comprises: a resin frame; a semiconductor substrate housed in the resin frame; a plate shape metal member having at least one end fixed in the resin frame at a position spaced apart from the semiconductor substrate; an electrical connection region portion formed on the surface on the side of the plate shape metal member of the semiconductor substrate with an electrically conductive material; and a solder layer formed on the surface on the side of the plate shape metal member of the electrical connection region portion, wherein the plate shape metal member supports the semiconductor substrate without contact through the solder layer and the electrical connection region portion, and is electrically connected to the electrical connection region portion.

CROSS REFERENCE

The present application is a continuation application of U.S. patentapplication Ser. No. 14/519,658, filed on Oct. 21, 2014, the entirecontents of which are incorporated herein by reference. The Ser. No.14/519,658 application claimed the benefit of the date of the earlierfiled Japanese Patent Application No. 2013-220292 filed Oct. 23, 2013,priority to which is also claimed herein, and the contents of which arealso incorporated by reference herein.

TECHNICAL FIELD

The present invention is related to an electronic component and a methodfor manufacturing an electronic component, in particular, related to anelectronic component and a method for manufacturing an electroniccomponent capable of simplifying connection assembling between asemiconductor substrate and a plate shape metal member such as a leadterminal piece, or the like.

BACKGROUND ART

As an electronic component of this kind, for example, in addition to anautomotive immobilizer, an antenna part for ID certification forperforming management of whereabouts of children after school,management of breeding of livestock, management of the entrance and exitat a station, and the like are referred (for example, refer to PatentLiterature 1: Japanese Laid-open Patent Application Publication No.S63-208236, Patent Literature 2: WO 2011/024559 and Patent Literature 3:Japanese Laid-open Patent Application Publication No. 2001-184471).

The electronic component described in Patent Literature 1 is an ICpackage, the IC package is made by sealing the surroundings with a resinafter connecting a semiconductor substrate (IC chip) and a lead terminalwith a wire.

The electronic component described in Patent Literature 2 is atransmitting antenna used in a keyless entry system by which locking andunlocking of a car door can be performed without key operation.

The electronic component described in Patent Literature 3 is an IC tagto be provided on a dish at a conveyor belt sushi shop.

Meanwhile, such an electronic component is generally configured with apassive component, an IC chip composed of a semiconductor substrate, abase member for mounting the passive component and the IC chip, and thelike.

Such an IC package is configured with a semiconductor substrate (ICchip) to be sealed in the package, a lead frame having a lead derivedfrom the package, a bonding wire of gold connected between a conductivepattern (land) provided to the semiconductor substrate in the packageand the lead frame, and the like.

However, with regard to providing a bonding wire of gold between thelead frame and the land of the semiconductor substrate, in an electroniccomponent such as a conventional IC package or the like, there wereproblems that it costed very high and the workability was poor due to alot of working man-hours.

CITATION LIST Patent literature

-   Patent Literature 1. Japanese Laid-open Patent Application    Publication No. S63-208236 (refer to FIG. 1)-   Patent Literature 2. WO 2011/024559-   Patent Literature 3. Japanese Laid-open Patent Application    Publication No. 2001-184471

SUMMARY OF INVENTION Technical Problem

Accordingly, the present invention has been made in view of the abovedescribed problems, it is an object of the present invention to providean electronic component and a method for manufacturing an electroniccomponent capable of simplifying connection assembling between asemiconductor substrate and a plate shape metal member such as a leadterminal piece, or the like and of reducing cost.

Solution to Problem

The present invention has been proposed in order to achieve the abovedescribed object. An aspect according to the present invention shall beunderstood by the structure described below.

(1) A first aspect according to the present invention is an electroniccomponent comprising: a resin frame; a semiconductor substrate housed inthe resin frame; a plate shape metal member having at least one endfixed in the resin frame at a position spaced apart from thesemiconductor substrate; an electrical connection region portion formedon the surface on the side of the plate shape metal member of thesemiconductor substrate with an electrically conductive material; and asolder layer formed on the surface on the side of the plate shape metalmember of the electrical connection region portion, wherein the plateshape metal member supports the semiconductor substrate without contactthrough the solder layer and the electrical connection region portion,and is electrically connected to the electrical connection regionportion.

(2) In the above described (1), the plate shape metal member may have ina region connected to the solder layer a bent portion projecting towardthe solder layer.

(3) In the above described (1) or (2), the resin frame may have a hollowportion housing the semiconductor substrate therein, and the plate shapemetal member may be electrically connected to the semiconductorsubstrate in the hollow portion.

(4) In any of the above described (1) to (3), the plate shape metalmember may be embedded and fixed in the resin frame at one end side, andmay be opened or embedded to be fixed in the resin frame at the otherend side.

(5) In any of the above described (1) to (4), the plate shape metalmember may comprise a copper alloy or a stainless steel having a Vickershardness of 50 Hv or more to 300 Hv or less.

(6) In any of the above described (3) to (5), the resin frame may have aprojecting portion extending to the hollow portion, the projectingportion having a contact portion positioning the semiconductor substratein contact with the at least one portion of the semiconductor substrate.

(7) A second aspect according to the present invention is a method formanufacturing an electronic component, comprising: an insert moldingstep of forming a resin frame so as to embed at least one end of a plateshape metal member therein, by injecting a resin in a mold withpositioning the plate shape metal member in the mold; a semiconductorsubstrate preparation step of providing a semiconductor substrate havingan electrical connection region portion formed with a conductivematerial and a solder layer on the surface in this order; asemiconductor substrate placing step of allowing the semiconductorsubstrate to be placed on the plate shape metal member by the selfweight, thereby the solder layer and a portion of the plate shape metalmember becoming to be in contact, having a downward facing surfacehaving the solder layer of the semiconductor substrate; and a reflowsoldering step of dissolving the solder layer by applying heat to thesolder layer, and electrically connecting the semiconductor substrateand the plate shape metal member.

Advantageous Effects of Invention

According to the present invention, an electronic component and a methodfor manufacturing an electronic component capable of simplifyingconnection assembling between a semiconductor substrate and a plateshape metal member such as a lead terminal piece, or the like and ofreducing cost can be provided.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view (seen from an upper surface side of anantenna unit) of an antenna unit illustrating an embodiment of anelectronic component according to the present invention.

FIG. 2 is a diagram for explaining the configuration of the abovedescribed antenna unit, and is a view seen from the lower surface.

FIG. 3 is an enlarged cross-sectional view taken along a line A-A ofFIG. 2.

FIG. 4 is an exploded perspective view explaining a structure in ahollow portion of above described antenna unit and a configuration of asemiconductor substrate to be housed in the hollow portion.

FIG. 5 is a diagram explaining one example of a method for manufacturingan electronic component of the present invention.

FIG. 6A is a phase diagram before reflow soldering for explaining asolder connection in the present embodiment.

FIG. 6B is a phase diagram after reflow soldering for explaining thesolder connection in the present embodiment.

FIG. 7A is an explanatory diagram of a structure of a resin frame sideexplaining a first modification example of the electronic component ofthe present invention.

FIG. 7B is an explanatory diagram of a structure of a back surface sideof the semiconductor substrate explaining the first modification of theelectronic component of the present invention.

FIG. 8A is an explanatory diagram of a structure of a resin frame sideexplaining a second modification example of the electronic component ofthe present invention.

FIG. 8B is an explanatory diagram of a structure of a back surface sideof the semiconductor substrate explaining a second modification exampleof the electronic component of the present invention.

FIG. 9 is a diagram explaining a third modification example according toa hollow portion of a resin frame in the electronic component of thepresent invention.

FIG. 10A is a diagram explaining a fourth modification example of a bentportion of a plate shape metal member in the electronic component of thepresent invention.

FIG. 10B is a diagram explaining a fifth modification example of a bentportion of a plate shape metal member in the electronic component of thepresent invention.

FIG. 10C is a diagram explaining a sixth modification example of a bentportion of a plate shape metal member in the electronic component of thepresent invention.

FIG. 10D is a diagram explaining a seventh modification example of abent portion of a plate shape metal member in the electronic componentof the present invention.

DESCRIPTION OF EMBODIMENT

Hereinafter, an embodiment of an electronic component according to thepresent invention shall be described in detail with reference todrawings. Note that the present invention is not limited by thisembodiment.

FIG. 1 to FIG. 4 illustrate an embodiment of an electronic componentaccording to the present invention. An antenna unit 11 as one example ofthe electronic component shall be described. As illustrated in FIG. 1and FIG. 2, an antenna unit 11 is provided with a unit body 12, anantenna coil 13 attached to the unit body 12, semiconductor substrate15, a pair of plate shape metal members 14, 14 spaced apart from thesemiconductor substrate 15, and a mounting plate 16, and the like.

The antenna coil 13 is made of a rod-like core 17, and a coil 18 woundwith a winding wire by a predetermined number of turns through aninsulation sheet material (not illustrated) on a periphery surface ofthe rod-like core 17. The coil 18 is provided with lead wires 18 a, 18 bfrom the winding.

The unit body 12 is provided with a resin frame 19 formed to apredetermined shape by injecting a resin material into a mold (notillustrated). In addition, when molding the resin frame 19, theso-called insert molding is carried out in which a pair of plate shapemetal members 14, 14 and a mounting plate 16 are placed respectively ata predetermined position in the mold, and in the state, the pair ofplate shape metal members 14, 14 and the mounting plate 16 are embeddedby injecting a resin material into the mold, and the resin frame 19 isintegrated with the pair of plate shape metal members 14, 14 and themounting plate 16.

Each plate shape metal member 14 has a function as a lead terminalpiece, and is formed by pressing a sheet material of a metal havingelasticity with a strength and a hardness to some extent, such as acopper alloy, a stainless steel or the like. Here, in the presentexample, from the viewpoint of convenience of manufacturing and costreduction, it is preferable that the plate shape metal member 14 isformed with the same material as the material of a lead frame to be usedin the semiconductor substrate 15. In particular, in order that theplate shape metal member 14 plays a role of supporting the plate shapemetal member 14 in a manner to be described later, a metal materialhaving a predetermined hardness is preferable. The hardness of the plateshape metal member 14 used in the present example is 50 Hv or more and300 Hv or less, in Vickers hardness.

Each one end side of the plate shape metal members 14, 14 is projectedto the outside from one side surface 19 a of the resin frame 19 asconnection terminals 14 a, 14 a, as illustrated in FIG. 1 and FIG. 2. Toeach of the connection terminals 14 a, 14 a, each of the lead lines 18a, 18 b of the coil 18 in the antenna coil 13 is bound and connectedelectrically and mechanically. Here, the rod-like core 17 of the antennacoil 13 is attached to a front surface 19 b of the resin frame 19, byfixing one end side.

Further, as illustrated in FIG. 2, on a back surface (lower surface 19c) side of the resin frame 19, a hollow portion 21 having an opening 20is formed. In the hollow portion 21, as illustrated in FIG. 2 to FIG. 4,the semiconductor substrate 15 can be housed by arranging in a plane.Therefore, the hollow portion 21 in the present example is formed in asize of the opening 20 being about the same as the plane of the squareshaped semiconductor substrate 15, and in a depth of a recess beingdeeper than the thickness of the semiconductor substrate 15.

Further, as illustrated in FIG. 4, in a bottom surface 21 a of thehollow portion 21, at the two corner portions on an inner side surface21 b in a side where connection terminals 14 a, 14 a of the plate shapemetal members 14, 14 are provided, of the two inner side surfaces 21 b,21 c where each of the two plate shape metal members 14, 14 is disposedthrough, each of a base 22 provided in a projected state toward theopening 20 from the bottom surface 21 a, and a projecting portion 23formed on the base 22, are provided integrally. Here, as illustrated inFIG. 3, a distance S1 between an upper surface 23 a of the projectingportion 23 and the opening 20 is formed in substantially the same as athickness t0 of the semiconductor substrate 15 (the thickness t0 is notincluded in thicknesses of a pad 27 and a solder layer 28 to bedescribed later). In addition, the hollow portion 21 does not neednecessarily to be formed into a bottomed shape provided with the bottomsurface 21 a, and can be formed as a hole penetrating vertically.

In the hollow portion 21, at each position corresponding to the bases22, 22, intermediate portions 14 c, 14 c of the plate shape metalmembers 14, 14 are disposed so as to cross in the right and leftdirection in the hollow portion 21, in a state where the other ends 14b, 14 b at the sides opposite to the connection terminals 14 a, 14 a areembedded in the resin frame 19. Further, as illustrated in FIG. 2 andFIG. 3, in the intermediate portions 14 c, 14 c disposed in the hollowportion 21, a bent portion 24 formed in a curve having a cross-sectionof an inverse V-shaped form is formed so as to project in a directionwhere the semiconductor substrate 15 is coming to be housed in the sidesof the other ends 14 b, 14 b, spaced apart from the projecting portion23, that is, a direction projecting toward the side of the opening 20 inthe present example. In addition, as illustrated in FIG. 4, a distanceS2 from a top 24 a of the bent portion 24 to the surface of the opening20 is formed slightly larger than a thickness t1 of the semiconductorsubstrate 15 illustrated in FIG. 6A (the thickness t1 includes thethickness t0 of the semiconductor substrate 15 and the thickness of thepad 27 to be described later). Here, an aspect where the sides of theother ends 14 b, 14 b are embedded in the resin frame 19 is illustrated,but without being limited to this, as described later in a firstmodification example 1, a cantilevered plate shape metal member 14 maybe possible where only the sides of the one ends 14 a, 14 a of the plateshape metal member 14 are fixed, and the sides of the other ends 14 b,14 b are opened, that is, free.

The mounting plate 16 is, for example, used when mounting the antennaunit 11 in a door handle that employs a keyless entry system thatperforms locking and unlocking of the door of an automobile or the likewithout key operation. As illustrated in FIG. 1 and FIG. 2, mountingholes 25, 26 into which a mounting screw (not illustrated) or the likeis inserted are provided in the other end side 14 b which is led outfrom a back surface 19 c of the resin frame 19, while the one end side14 b is embedded in the resin frame 19 and attached.

The semiconductor substrate 15, is composed of a semiconductor materialsuch as a single crystal, a polycrystalline Si substrate, a SiCsubstrate, a GaN substrate, or the like, in the present example, and amulti-layer integrated circuit is formed therein. Further, on the sideof the surface to be mounted toward the bottom surface 21 a of thehollow portion 21 (the lower surface 15 a), as illustrated in FIG. 2 toFIG. 5, a pair of pads 27, 27 as an electrical connection region portionare formed corresponding to each of the bent portion 24 of the plateshape metal members 14, 14. The pads 27,27 are generally composed of analloy or a compound having good compatibility with both a metal and asemiconductor, and is formed with a conductive material capable ofconducting electricity. Further, on the surface of the pads 27, 27, acreamy solder layer 28 composed primarily of tin is formed. Note thathere, so that scratches to the semiconductor substrate 15 are not causedby the plate shape metal member 14, it is preferable that a height ofthe solder layer 28 is 5 times or more and 20 times or less of theheight of the pad 27. In the present example, the height of the pad 27is about 0.008 mm and the total height of the pad 27 and the solderlayer 28 is 0.06 mm or more and 0.10 mm or less.

And, the semiconductor substrate 15 is dropped into the hollow portion21 of the resin frame 19 such that the surface having the pad 27provided with the solder layer 28 faces down, and is housed in thehollow portion 21 so as to be buried therein. Then, the solder layer 28and the pad 27 correspond to the bent portions 24, 24 of the plate shapemetal members 14, 14, respectively, and the projecting portions 23, 23in the hollow portion 21 contact with the lower surface 15 a of thesemiconductor substrate 15. And, the semiconductor substrate 15 issupported by a very small force (corresponding to the self weight of thesemiconductor substrate 15) in the projecting portions 23, 23 and thebent portions 24, 24 of the plate shape metal members 14, 14 in thehollow portion 21. Further, in this state, the solder layer 28 is meltby placing the antenna unit 11 in a reflow furnace (not illustrated) andflowing hot air, and then the solder layer 28 is cooled and solidified,and the semiconductor substrate 15 and the plate shape metal member 14are integrated.

Meanwhile, before reflow soldering, due to the self weight of thesemiconductor substrate 15, the plate shape metal member 14 comes toenter the solder layer 28, but since the weight of the semiconductorsubstrate 15 is light, as illustrated in FIG. 6B, the plate shape metalmember 14 does not enter the solder layer 28 up to the state where thebent portion 24 contacts with the pad 27, and the pad 27 and the bentportion 24 are, as illustrated in FIG. 6B, in non-contact state evenafter reflow soldering and do not contact directly. In other words, evenduring reflow soldering, the solder of the solder layer 28 melts, butsince the self weight of the semiconductor substrate 15 is light, thebent portion 24 of the plate shape metal member 14 does not breakthrough the solder layer and does not contact with the pad 27 directly.At this time, of course, the plate shape metal member 14 does notcontact with the surface of the semiconductor substrate 15. Note that,in a form other than the form illustrated in FIG. 6B, it may be possiblethat the plate shape metal member 14 breaks through the solder layer 28and contacts with the pad 27 in a extent where the pad 27 is not brokenthrough. In brief, as far as the plate shape metal member 14 and thesemiconductor substrate 15 are not damaged, various kinds ofmodifications can be applied.

Further, though it is not illustrated, the whole antenna unit 11 formedin this way, except the mounting portion of the mounting plate 16, issealed with a resin and is completed.

FIG. 5 is a block diagram illustrating one example of manufacturingsteps of the antenna 11. With reference to FIG. 5, the manufacturingsteps of the antenna 11 are explained in the order of (1) to (5).

(1) In an insert molding step, a pair of plate shape metal members 14,14 and a mounting plate 16 are placed at a predetermined position in themold respectively, and in the state, a resin material is injected intothe mold so that the plate shape metal members 14, 14 and the mountingplate 16 are embedded in the resin, that is, a so-called insert moldingis performed, and a resin frame 19 is formed.

(2) In a semiconductor substrate preparation step, a semiconductorsubstrate having a pad 27 as an electrical connection region portionformed with a conductive material and having a creamy solder layer 28composed primarily of tin on the surface of the pad 27, is prepared.

(3) In a semiconductor substrate placing step, the surface having thesolder layer 28 is faced down, the semiconductor substrate 15 is droppedinto the hollow portion 21 by the self weight so that the solder layer28 and a top 24 a of a bent portion 24 which is a part of the plateshape metal member 14, and the semiconductor substrate 15 is placed onthe plate shape metal member 14. Therefore, by the self weight of thesemiconductor substrate 15, the bent portion 24 of the plate shape metalmember 14 comes to enter the solder layer 28, but since the weight ofthe semiconductor substrate 15 is light, the bent portion 24 of theplate shape metal member 14 does not contact with the surface of the pad27 to the semiconductor substrate 15 directly. FIG. 6A illustrates astate before the reflow. In addition, by placing the semiconductorsubstrate 15 after applying a flux treatment to the bent portion 24 ofthe plate shape metal member 14, further reliable bonding becomespossible.

(4) In the reflow soldering step, an antenna 11 is placed in a reflowfurnace, hot air is supplied, the solder layer 28 is melt, and thesemiconductor substrate 15 and the plate shape metal member 14 areintegrated. At this time, the solder melts and flows around the bentportion 24 of the plate shape metal member 14, and sometimes alsointrude the recess of the bent portion 24 of the plate shape metalmember 14. FIG. 6A illustrates a state before the reflow solderingtreatment, and FIG. 6B illustrates a state after the reflow solderingtreatment. In addition, with regard to the reflow soldering treatment,besides placing in a reflow furnace, a spot reflow device may be used,or a treatment of melting the solder layer 28 with a laser may beapplied.

(5) In a sealing step, almost the whole antenna unit 11, except themounting portion of the mounting plate 16, is sealed with a resin andthe antenna unit 11 is completed. Here, the antenna unit 11 illustratedin FIG. 1 to FIG. 3 is represented in a state before sealing with theresin. That is, the antenna unit 11 may be used without being sealedwith a resin.

Thus, in the antenna unit 11 which is an electronic component formed inthis way, when assembling the plate shape metal member 14 and thesemiconductor substrate 15, the plate shape metal member 14 supports thesemiconductor substrate 15 through the solder layer 28 provided on thesurface of the pad 27 which is an electrical connection region portionformed on the surface of the semiconductor substrate 15, and when thesolder layer 28 is melt in this state, a part of the melted solder layer28 flows in between the plate shape metal member 14 and the pad 27, andthe plate shape metal member 14 and the semiconductor substrate 15 areelectrically connected.

Further, in the plate shape metal member 14, in the region connectingthe semiconductor substrate 15 to the solder layer 28, a bent portion 24curved so as to project toward the solder layer 28 is provided, and sowhen the semiconductor substrate 15 is disposed in the hollow portion21, a part of the bent portion 24 easily intrudes into the solder layer28. In addition, when the solder layer 28 melts, the solder layer 28enters the surroundings of the projected bent portion 24, the meltedsolder flows around the bent portion 24, stable electrical connectionand fixation can be realized between the plate shape metal member 14 andthe semiconductor substrate 15.

Further, the resin frame 19 has a hollow portion 21 for housing thesemiconductor substrate 15, and the semiconductor substrate 15 iselectrically connected to the plate shape metal member 14 in the hollowportion 21 where the semiconductor substrate 15 is housed and arrangedtherein, and so positioning of the semiconductor substrate 15 to theresin frame 19 is easy, and electrical connection and fixation betweenthe plate shape metal member 14 and the semiconductor substrate 15 canbe performed stably.

Note that the present invention can be modified and carried out asillustrated in FIG. 7. As illustrated in FIG. 7A, a first modificationexample has a structure provided with four pieces of plate shape metalmembers 14 in a cantilever where each two pieces among the four piecesextend each from inner side surfaces 21 b, 21 c at the right and theleft of the hollow portion 21. Further, at the free end sides of thefour pieces of the plate shape metal members 14 extending in the hollowportion 21, a bent portion 24 formed in a curve having a cross-sectionof an inverse V-shaped form so as to project in a direction where thesemiconductor substrate 15 is coming to be housed, that is, a directionprojecting toward the side of the opening 20 (semiconductor layerdescribed later), is provided respectively. In addition, a distance S2from a top 24 a of the bent portion 24 to the opening 20 is formedslightly larger than the thickness t1 of the semiconductor substrate 15.

On the other hand, the semiconductor substrate 15 to be housed in thehollow portion 21 is, as illustrated in FIG. 7B, provided with a pad 27having a solder layer 28 in positions corresponding to the four piecesof the bent portions 24 of the plate shape metal member 14.

And, in this example, the semiconductor substrate 15 is dropped into thehollow portion 21 of the resin frame 19 and housed in the hollow portion21 in a state embedded therein, so that a surface (lower surface 15 a)provided with the pad 27 having the solder layer 28 faces down. Then,the solder layer 28 and the pad 27 come to correspond to the bentportion 24 of the plate shape metal member 14 respectively, and the bentportion 24 contacts the lower surface 15 a of the semiconductorsubstrate 15 through the solder layer 28 and the pad 27. And, thesemiconductor substrate 15 is supported by the bent portions of the fourpieces of the plate shape metal members 14 in the hollow portion 21.Further, in this state, the antenna 11 is placed in a reflow furnace(not illustrated), hot air is supplied and the solder layer 28 is melt,and then the solder layer 28 is cooled and solidified, and thesemiconductor substrate 15 and the plate shape metal member 14 areelectrically and mechanically fixed.

In this example, the base 22 and the projecting portion 23 having beenprovided in the above described embodiment are omitted, and instead, bysupporting the semiconductor substrate 15 with the bent portions 24provided to the four pieces of the plate shape metal members 14, thesemiconductor substrate 15 can be electrically and mechanically fixed.In addition, two pieces of the plate shape metal members 14 are allowedto connect to lead lines 18 a, 18 b of a coil 18, and the remaining twopieces of the plate shape metal members 14 may be connected to anotherelectric circuit and used.

Further, the present invention can be modified and carried out asillustrated in FIG. 8. A second modification example is, as illustratedin FIG. 8A, provided integrally with, at two corners connected by adiagonal of a hollow portion 21, bases 22 projecting each toward anopening 20 from a bottom surface 21 a and projecting portions 23 formedon the bases 22. In this case, a distance S2 between the projectingportion 23 and the opening 20 is also formed to substantially the sameas the thickness t0 of the semiconductor substrate 15. Further, theplate shape metal members 14, 14 are disposed in a state where theintermediate portions 14 c, 14 c cross in the right and left directionin the hollow portion 21, and the other ends 14 b, 14 b at the sidesopposite to the connection terminals 14 a, 14 a are embedded in theresin frame 19, at a position where the base 22 is provided. Further, inthe intermediate portions 14 c, 14 c disposed in the hollow portion 21,a bent portion 24 formed in a curve having a cross-section of an inverseV-shaped form is formed so as to project in a direction where thesemiconductor substrate 15 is coming to be housed, that is, a directionprojecting toward the side of the opening 20 (in other words, the sideof the solder layer 28 of the semiconductor substrate 15) in the presentexample. The bent portions 24 are provided respectively at positionssymmetrical to each other apart from the base 22 by a predetermineddistance. In addition, a distance S2 from the top 24 a of the bentportion 24 to the opening 20 is formed slightly larger than thethickness t1 of the semiconductor substrate 15.

On the other hand, the semiconductor substrate 15 to be housed in thehollow portion 21, as illustrated in FIG. 8B, is provided with the pad27 having the solder layer 28, at positions corresponding to the bentportions 24 of the two pieces of the plate shape metal members 14,respectively.

And, also in this example, the semiconductor substrate 15 is droppedinto the hollow portion 21 of the resin frame 19 and housed in thehollow portion 21 in a state embedded therein, so that a surface (lowersurface 15 a) provided with the pad 27 having the solder layer 28 facesdown. Then, the solder layer 28 and the pad 27 come to correspond to thebent portion 24 of the plate shape metal member 14 respectively, and thebent portion 24 contacts the lower surface 15 a of the semiconductorsubstrate 15 through the solder layer 28 and the pad 27. And, thesemiconductor substrate 15 is supported by the bent portions of the fourpieces of the plate shape metal members 14 in the hollow portion 21.Further, in this state, the antenna 11 is placed in a reflow furnace(not illustrated), hot air is supplied and the solder layer 28 is melt,and then the solder layer 28 is cooled and solidified, and thesemiconductor substrate 15 and the plate shape metal member 14 areelectrically and mechanically fixed.

FIG. 9 illustrates a third modification according to the hollow portion21. In the hollow portions 21 illustrated in FIG. 2 to FIG. 8, astructure is disclosed where four inner side surfaces are formed as acontinuing recess without interruption, but in the hollow portions 21illustrated in FIG. 9, a structure is taken where one inner side surfaceis provided with a notch portion 29 leading to an outer side surface.With such a structure, even when the size of the opening 20 of thehollow portion 21 is smaller than the area of the semiconductorsubstrate 15, the opening 20 spreads due to the notch portion 29, anerror and the like with the semiconductor substrate 15 can be absorbed.Further, the thermal expansion of the semiconductor substrate 15 and theresin frame 19 can be absorbed.

FIG. 10 illustrates a plurality of modification examples of a bentportion 24 to be provided in the plate shape metal member 14.

FIG. 10A is a fourth modification example, where a V-shaped ceilingportion 24 b forming the bent portion 24 is formed in a plane, and theceiling portion 24 b contacts to the solder layer 28 with the plane. Inthis configuration, a time for the bent portion 24 to intrude the solderlayer 28 can be adjusted so as to be delayed.

FIG. 10B is a fifth modification example, a modified version of FIG.10A, where a through hole 30 in a vertical direction is provided in theceiling portion 24 b. In this configuration, the melted solder layer 28enters the through hole 30, and integration with the bent portion 24 canbe achieved.

FIG. 10C is a sixth modification example, also a modified version ofFIG. 10A, where the ceiling portion 24 b is provided with a notchportion 31 penetrating in a vertical direction. Also in thisconfiguration, the melted solder layer 28 enters the notch portion 31,and integration with the bent portion 24 can be achieved.

FIG. 10D is a seventh modification example, where the bent portion 24 isformed in a curved surface of a bow-shape, and contacts to the solderlayer 28 with the curved surface. Also in this configuration, a time forthe bent portion 24 to intrude the solder layer 28 can be adjusted so asto be delayed.

In addition, in the embodiment, in the reflow soldering step, it isdisclosed that the bent portion 24 intrudes into the melted solder layer28 by the self weight of the semiconductor substrate 15 and a connectionis performed, but on the contrary, the connection can be performed usingthe self weight of the resin frame 19. In addition, the connection ofthe semiconductor substrate 15 and the plate shape metal member 14 maybe performed using a method such as Flip-Chip. In this case, it isnecessary to apply a special plating, for example, a thick layer platingof Au or Cu in advance to the plate shape metal member 14.

According to the electronic component according to the above embodiment,when assembling the plate shape metal member and the semiconductorsubstrate, the plate shape metal member supports the semiconductorsubstrate through the solder layer provided to the electrical connectionregion portion such as the pad and the like formed on the surface of thesemiconductor substrate, and in this state, the solder layer is melted.Then, a part of the melted solder layer flows in between the plate shapemetal member and the electrical connection region portion, an electricalconnection is made between the plate shape metal member and thesemiconductor substrate. Further, then, by solidifying the solder layer,an electronic component can be easily obtained where the plate shapemetal member and the electrical connection region portion are connectedand fixed electrically and mechanically with each other.

In the case the plate shape metal member is provided with a bentportion, when the solder layer is melted, the bent portion projectingtoward the solder layer enters the solder layer and the melted solderflows around the bent portion, and after the solder layer hassolidified, stable electrical connection and fixation can be realizedbetween the plate shape metal member and the semiconductor substrate.

In the case the resin frame has a hollow portion for housing thesemiconductor substrate, when the semiconductor substrate is housed anddisposed in the hollow portion of the resin frame, the semiconductorsubstrate is positioned in the resin frame, and electrical connectionand fixation between the plate shape metal member and the semiconductorsubstrate can be made stably. In the plate shape metal member, while oneend side is embedded and fixed in the resin frame, the other end sidemay be either opened or embedded and fixed in the resin frame, andeither of the ways can be selected depending on the installationlocation and the application of the electronic component. In the casethe other end side is opened as a free end, when the electroniccomponent is installed in a vehicle and the like, it is possible torelieve stress due to vibrations of the vehicle body and the like.

In the case the plate shape metal member includes a copper alloy or astainless steel and the Vickers hardness thereof is 50 Hv or more and300 Hv or less, by supporting the semiconductor substrate using such theplate shape metal member, the plate shape metal member can support thesemiconductor substrate stably. Thus, electrical connection and fixationbetween the plate shape metal member and the semiconductor substrate canbe made stably.

In the case the resin frame has a projecting portion extending in thehollow portion, a positioning contact portion and the plate shape metalmember can stably support the semiconductor substrate housed anddisposed in the hollow portion, and further, electrical connection andfixation between the plate shape metal member and the semiconductorsubstrate can be made stably.

According to the method of manufacturing an electronic componentaccording to the above embodiment, in the insert molding step, the resinframe having one end of the plate shape metal member embedded therein isformed, and in the semiconductor substrate preparation step, thesemiconductor substrate having the electrical connection region portionon the surface and having the solder layer on the surface of theelectrical connection region portion is provided, and in thesemiconductor substrate placing step, the semiconductor substrate isplaced by the self weight on the plate shape metal member, the surfaceof the semiconductor substrate having the solder layer faces down, andthe solder layer and a part of the late shape metal member are incontact, and then, in the reflow soldering step, when the solder layeris melted with heat, while the semiconductor substrate drops by the selfweight, a part of the solder flows in between the plate shape metalmember and the electrical connection region portion, and electricalconnection is made between the plate shape metal member and theelectrical connection region portion of the semiconductor. Further,then, when the solder layer is solidified, an electronic component canbe easily obtained where the plate shape metal member and the electricalconnection region portion are electrically and mechanically connectedeach other.

REFERENCE SIGNS LIST

-   11 . . . antenna unit (electronic part); 12 . . . unit body; 13 . .    . antenna coil; 14 . . . plate shape metal member; 14 a . . .    connection terminal (one end side); 14 b . . . other end side; 14 c    . . . intermediate portion; 15 . . . semiconductor substrate; 15 a .    . . lower surface; 16 . . . mounting plate; 17 . . . rod-like core;    18 . . . coil; 18 a, 18 b . . . lead line; 19 . . . resin frame-   19 a . . . side surface; 19 b . . . front surface; 19 c . . . lower    surface; 20 . . . opening; 21 . . . hollow portion; 21 a . . .    bottom surface; 21 b . . . inner side surface; 22 . . . base; 23 . .    . projecting portion; 23 a . . . top surface of projecting portion    (contact portion); 24 . . . bent portion; 24 a . . . top; 24 b . . .    ceiling portion; 25, 26 . . . mounting hole; 27 . . . pad    (electrical connection region portion); 28 . . . solder layer; 29 .    . . notch portion; 30 . . . through hole; 31 . . . notch portion; S1    . . . distance; S2 . . . distance; t0, t1 . . . thickness of    semiconductor substrate; h . . . height of solder layer

1. A method for manufacturing an electronic component, comprising: aninsert molding step of placing a metal member in a mold, and injecting aresin material within the mold, a semiconductor substrate providing stepof providing a semiconductor substrate; forming a pad of an electricalconnection region on a surface of the semiconductor substrate; andforming a solder layer on a surface of the pad, the pad being formed ofconductive material, a semiconductor substrate placing step of placingthe semiconductor substrate on the metal member, wherein, although aportion of the metal member enters the solder layer, the metal member isnot in contact with the semiconductor substrate, and a soldering step ofmelting the solder layer to integrate the semiconductor substrate withthe metal member.
 2. The method according to claim 1, wherein: in thesemiconductor substrate placing step, the surface of the semiconductorsubstrate having the solder layer thereon is downwardly placed, and dueto a weight of the semiconductor substrate, the portion of the metalmember comes to enter the solder layer of the semiconductor substrate.3. The method according to claim 1, wherein the portion of the metalmember which comes to enter the solder layer has a bent shape, which isobtained via a separate bending process.
 4. The method according toclaim 3, wherein the portion of the metal member with the bent shape isfurther subjected to a flux treatment.
 5. The method according to claim1, wherein: in the semiconductor substrate placing step, the portion ofthe metal member which comes to enter the solder layer is not in contactwith the pad of the semiconductor substrate.
 6. The method according toclaim 1, wherein: in the soldering step, the solder layer is melt withheat.
 7. The method according to claim 1, wherein: in the solderingstep, the metal member is not in contact with the semiconductorsubstrate.
 8. The method according to claim 1, wherein: in the solderingstep, a melt solder layer flows around the portion of the metal member.9. The method according to claim 1, further comprising a sealing step ofsealing the metal member and the semiconductor substrate with a resin.10. The method according to claim 9, wherein: in the sealing step, themetal member except for a mounting plate is sealed.